Lau J Advanced Substrates, Failure Mechanisms, and Thermal Management 2025 | 74.84 MB

Title: Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author: John Lau · Xuejun Fan

Description:
Kompleksowe opracowanie dotyczące mechanizmów w chemii organicznej.

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